A good layout and routing practice is to keep the analog and digital grounds separate, use a star-grounding configuration, and keep the sensitive analog signals away from the digital signals. Additionally, use a 4-layer PCB with a solid ground plane and a separate power plane to reduce noise and EMI.
The TLV5638MDREP has an internal calibration circuit that is enabled by applying a specific voltage to the CAL pin. The calibration procedure involves applying a voltage to the CAL pin, waiting for the calibration cycle to complete, and then verifying the output voltage. Refer to the application note SLAA642 for detailed calibration procedures.
The TLV5638MDREP has a maximum junction temperature of 150°C. To ensure reliable operation, ensure good thermal conductivity between the device and the PCB, use a thermal pad or heat sink if necessary, and avoid operating the device near its maximum temperature rating.
The TLV5638MDREP has a built-in POR and BOR circuitry that resets the device during power-up or brown-out conditions. To handle these features, ensure that the power supply is stable and within the recommended operating range, and use external circuitry to debounce the reset signal if necessary.
To ensure EMI and EMC compliance, use a shielded enclosure, keep the device away from radiating sources, use a common-mode choke or ferrite bead on the power lines, and follow good PCB layout and routing practices. Additionally, ensure that the device is operated within its recommended operating conditions and follow the guidelines outlined in the application note SLAA643.
TLV5638MDREP datasheet
by Texas Instruments
