The maximum power dissipation of the TLV2460CD is dependent on the package type and ambient temperature. For the D package (SOIC), the maximum power dissipation is 670 mW at 25°C. For the CD package (MSOP), it is 440 mW at 25°C. See the datasheet for more information on power dissipation calculations.
To minimize noise and ensure optimal performance, follow good PCB layout practices such as separating analog and digital grounds, using a solid ground plane, and keeping signal traces short and direct. Additionally, place decoupling capacitors close to the op-amp power pins and use a low-ESR capacitor for the bypass capacitor. See the datasheet for more layout recommendations.
The recommended capacitor value for the bypass capacitor (CBYP) is 0.01 μF to 0.1 μF. A larger capacitor value can improve power supply rejection ratio (PSRR) but may increase the startup time of the op-amp. A smaller capacitor value can reduce startup time but may degrade PSRR. See the datasheet for more information on bypass capacitor selection.
Choose resistors with a low temperature coefficient (TCR) and a high power rating to minimize thermal noise and ensure stability. The feedback resistors should be matched to within 0.1% to ensure optimal performance. See the datasheet for more information on feedback network design.
The maximum input voltage range of the TLV2460CD is from -0.2 V to VCC - 1.5 V. Exceeding this range can cause the op-amp to operate outside of its specifications or even damage the device.
TLV2460CD datasheet
by Texas Instruments
