It is recommended to follow a star-grounding scheme, keep analog and digital grounds separate, and use a solid ground plane to minimize noise. Additionally, keep the input and output traces short and away from each other to reduce crosstalk.
Ensure good airflow around the device, avoid blocking airflow vents, and consider using a heat sink if the device is expected to operate in high-temperature environments. Monitor the device's junction temperature (TJ) to ensure it remains within the specified range of -40°C to 125°C.
Not using the recommended bypass capacitors can lead to instability, oscillations, and reduced performance. The capacitors help to filter out noise and ensure a stable power supply to the device. Omitting them can result in reduced accuracy, increased noise, and potential device failure.
The TLV1391IDBVR has an internal OVP feature that limits the input voltage to prevent damage. If an overvoltage condition is detected, the device will enter a high-impedance state. To handle OVP, ensure that the input voltage is within the specified range, and consider adding external overvoltage protection circuitry if necessary.
Not following the recommended PCB layout and spacing guidelines can lead to reduced performance, increased noise, and potential device failure. Ensure that the device is placed on a solid ground plane, and maintain a minimum of 0.5 mm spacing between the device and other components to prevent thermal and electrical interference.
TLV1391IDBVR datasheet
by Texas Instruments
