The TLE2425MD is a high-frequency device, so it's essential to follow good layout practices to minimize noise and ensure proper operation. TI recommends placing the device close to the power supply, using short traces, and avoiding vias under the device. A solid ground plane and decoupling capacitors are also crucial.
The TLE2425MD can deliver up to 1A of current, which requires careful consideration of PCB trace width, thermal management, and component selection. Ensure that your PCB traces are wide enough to handle the current, and consider using thermal vias or heat sinks to dissipate heat. Choose components with suitable current ratings and thermal characteristics.
The TLE2425MD's output voltage regulation is affected by the input voltage. The device has a built-in voltage regulator that maintains a stable output voltage (VCC) despite input voltage variations. However, the input voltage range (2.7V to 10V) affects the output voltage regulation. For optimal performance, ensure that the input voltage is within the recommended range.
To ensure EMC, follow good design practices such as using a solid ground plane, decoupling capacitors, and shielding. Place the TLE2425MD away from noise-sensitive components, and use ferrite beads or common-mode chokes to filter out high-frequency noise. Additionally, consider using a metal shield or enclosure to contain electromagnetic radiation.
The TLE2425MD has a maximum junction temperature (TJ) of 150°C. Ensure that your design provides adequate thermal management, such as heat sinks, thermal vias, or thermal pads, to keep the device within its operating temperature range. Also, consider the thermal resistance of the PCB and surrounding components.
TLE2425MD datasheet
by Texas Instruments
