The maximum power dissipation of the TLE2074ACN is dependent on the package type and ambient temperature. For the DIP package, it is 840mW at 25°C. For the SOIC package, it is 625mW at 25°C. Refer to the thermal characteristics table in the datasheet for more information.
To ensure stability in a unity-gain configuration, it is recommended to add a capacitor (typically 10-22pF) between the output and the inverting input pins. This is because the TLE2074ACN has a high slew rate and can oscillate at high frequencies without this compensation.
To minimize noise and EMI, it is recommended to follow good PCB layout practices, such as keeping the input and output traces separate, using a solid ground plane, and placing decoupling capacitors close to the power pins. Additionally, avoid running high-frequency signals near the op-amp inputs.
While the TLE2074ACN can be used as a comparator, it is not recommended due to its relatively slow slew rate and limited output current. Texas Instruments recommends using a dedicated comparator device, such as the LM339 or LM2901, for comparator applications.
To prevent electrostatic discharge (ESD) damage, it is recommended to handle the TLE2074ACN with an anti-static wrist strap or mat, and to ensure that the device is stored in an anti-static bag or tube. Additionally, avoid touching the device pins or handling the device in a way that could generate static electricity.
TLE2074ACN datasheet
by Texas Instruments
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