The maximum power dissipation of the TLE2072CP is dependent on the package type and thermal resistance. For the DIP package, the maximum power dissipation is approximately 1.4W. For the SOIC package, it is approximately 1.1W.
To ensure stability in a unity-gain buffer configuration, it is recommended to add a capacitor (typically 10-100pF) between the output and the inverting input to prevent oscillations.
To minimize noise and EMI, it is recommended to keep the input and output traces short and away from each other, use a ground plane, and decouple the power supply with a 0.1uF capacitor.
The TLE2072CP is rated for operation up to 125°C, but the maximum junction temperature should not exceed 150°C. It is recommended to derate the power dissipation at high temperatures to prevent thermal runaway.
The feedback resistor values should be chosen based on the desired gain and bandwidth of the amplifier. A good starting point is to use a ratio of Rf/Ri = 2-10, and then adjust as needed to achieve the desired performance.
TLE2072CP datasheet
by Texas Instruments
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