The maximum power dissipation of the TLE2061ACD is dependent on the package type and ambient temperature. For the DIP package, the maximum power dissipation is 840mW at 25°C. For the SOIC package, it is 670mW at 25°C. Refer to the thermal characteristics section of the datasheet for more information.
To ensure stability in a unity-gain configuration, it is recommended to add a capacitor (typically 10-100pF) between the output and the inverting input pins. This helps to compensate for the internal pole of the op-amp and prevent oscillations.
To minimize noise and EMI, it is recommended to follow good PCB layout practices such as keeping the input and output traces separate, using a solid ground plane, and placing decoupling capacitors close to the op-amp. Additionally, it is recommended to use a low-impedance power supply and to avoid running high-frequency signals near the op-amp inputs.
The TLE2061ACD is rated for operation up to 125°C, but its performance may degrade at high temperatures. It is recommended to derate the power dissipation and to ensure that the junction temperature does not exceed 150°C. Additionally, it is recommended to consult the reliability report and the datasheet for more information on high-temperature operation.
The choice of resistors for the feedback network depends on the desired gain, bandwidth, and noise performance. It is recommended to choose resistors with low thermal noise and low parasitic capacitance. Additionally, it is recommended to follow the guidelines in the datasheet for selecting the optimal resistor values for the desired application.
TLE2061ACD datasheet
by Texas Instruments
