Texas Instruments recommends a star-ground configuration, with the analog and digital grounds separated and connected at a single point. Additionally, keep the input and output traces short and away from noise sources, and use a solid ground plane to reduce electromagnetic interference (EMI).
The TLE2027MDREP has a maximum junction temperature of 150°C. Ensure good thermal conductivity by using a heat sink or thermal pad, and keep the device away from heat sources. Also, consider derating the device's power consumption at high temperatures to prevent overheating.
Power up the VCC pin first, followed by the VREF pin, and then the input signals. This sequence helps prevent latch-up and ensures proper device operation. Also, ensure that the input signals are within the recommended voltage range during power-up.
Use an oscilloscope to monitor the input and output signals, and check for noise, ringing, or oscillations. Verify that the device is properly powered, and the input signals are within the recommended voltage range. Also, check for layout and routing issues, and ensure that the device is not overheating.
The TLE2027MDREP is not specifically designed for radiation-hardened or high-reliability applications. However, Texas Instruments offers other devices that are designed for such applications, such as the RH1024 or the LM6124. Consult the datasheet and application notes for these devices to determine their suitability for your specific application.
TLE2027MDREP datasheet
by Texas Instruments
Findchips
