Texas Instruments recommends a star-ground configuration, with the analog and digital grounds separated and connected at a single point. Additionally, keep the analog and digital signal traces separate and avoid running them parallel to each other. Use a solid ground plane and avoid vias under the device to minimize inductance.
The TLE2024ACDW has a thermal pad on the bottom of the package, which should be connected to a solid ground plane or a thermal relief pattern on the PCB. Ensure good airflow around the device, and consider using a heat sink or thermal interface material if operating in high-temperature environments.
Power up the VCC supply before the VDD supply, and ensure that the VCC supply is stable before applying the VDD supply. This prevents latch-up and damage to the device.
Use a shielded enclosure, and ensure that the PCB layout and routing minimize radiated emissions. Use bypass capacitors on the power supplies, and consider adding ferrite beads or common-mode chokes to reduce electromagnetic interference (EMI).
Use a logic analyzer or oscilloscope to monitor the digital signals, and a multimeter or oscilloscope to measure the analog signals. Use a breakout board or a development kit to simplify testing and debugging. Consider using a simulation tool or SPICE model to simulate the device behavior before prototyping.
TLE2024ACDW datasheet
by Texas Instruments
