Texas Instruments provides a recommended PCB layout in the TLE2021QDRQ1 datasheet, which includes guidelines for component placement, trace routing, and grounding. Additionally, TI recommends using a 4-layer PCB with a solid ground plane and a separate analog ground plane to minimize noise and ensure optimal performance.
The TLE2021QDRQ1 has a maximum junction temperature of 150°C. To handle thermal management, TI recommends using a heat sink or a thermal pad on the exposed pad of the QFN package, and ensuring good airflow around the device. Additionally, reducing the power consumption and using a lower supply voltage can also help reduce the junction temperature.
The recommended input and output termination for the TLE2021QDRQ1 depends on the specific application and signal frequency. However, TI recommends using a 50-ohm termination for high-frequency signals, and a 1-kohm to 10-kohm termination for low-frequency signals. Additionally, using a series resistor and a capacitor in parallel with the input or output can help filter out noise and improve signal integrity.
To ensure EMC with the TLE2021QDRQ1, TI recommends using a shielded enclosure, keeping the device away from noise sources, and using a common-mode choke or ferrite bead on the input and output lines. Additionally, using a low-pass filter or a shielded cable can help reduce electromagnetic radiation and improve EMC.
The recommended power-up and power-down sequence for the TLE2021QDRQ1 is to power up the analog supply (VCC) before the digital supply (VDD), and to power down the digital supply before the analog supply. This helps prevent damage or malfunction due to voltage sequencing issues.
TLE2021QDRQ1 datasheet
by Texas Instruments
