Texas Instruments provides a recommended layout and routing guide in their application note SLVAE03, which includes guidelines for PCB layout, component placement, and routing to minimize noise and ensure optimal performance.
The TLC2274CDG4 has a built-in POR and BOR circuitry, but it's essential to ensure that the power supply ramps up slowly enough to allow the POR to function correctly. A recommended approach is to use a power-on reset controller like the TPS3808G01 to generate a reset signal to the TLC2274CDG4.
While the datasheet doesn't specify a maximum capacitive load, Texas Instruments recommends limiting the capacitive load to 100 pF or less to ensure stability and prevent oscillations. Exceeding this limit may require additional circuitry to ensure stability.
The TLC2274CDG4 is rated for operation up to 125°C, but it's essential to consider the device's thermal characteristics and ensure that the junction temperature (TJ) remains within the specified range. Proper thermal design, including heat sinking and thermal management, is crucial for reliable operation in high-temperature environments.
To ensure EMC, follow proper PCB design and layout practices, such as using a solid ground plane, minimizing trace lengths, and using shielding and filtering components as needed. Additionally, consider using a common-mode choke or ferrite bead to reduce electromagnetic interference (EMI).