Texas Instruments recommends a 2-layer PCB with a solid ground plane on the bottom layer and a thermal relief pattern on the top layer to minimize thermal resistance. A minimum of 2 oz copper thickness is recommended for the top layer.
To ensure reliable operation at high temperatures, it's essential to follow proper thermal design and layout guidelines, including providing adequate heat sinking, using a thermally conductive material for the PCB, and minimizing power dissipation in the device.
Although the datasheet specifies a maximum input voltage of 5.5V, it's recommended to limit the input voltage to 5V to ensure reliable operation and prevent damage to the device.
While the TL750M05CKC is designed for low-power applications, it can be used in high-current applications with proper thermal design and heat sinking. However, it's essential to ensure that the device does not exceed its maximum power dissipation rating.
To troubleshoot issues with the TL750M05CKC, start by verifying the power supply voltage, checking for proper PCB layout and thermal design, and ensuring that the input and output pins are not overloaded. Use an oscilloscope to monitor the output voltage and current, and consult the datasheet and application notes for guidance.