TL1963A-25KTTR datasheet by Texas Instruments

TL1963A-25KTTR Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  Texas Instruments recommends a thermal pad on the bottom of the package, connected to a copper plane on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, vias should be placed under the thermal pad to connect to the copper plane.
• How do I ensure reliable operation in high-temperature environments?
  To ensure reliable operation in high-temperature environments, it is recommended to derate the output current and voltage according to the temperature derating curve provided in the datasheet. Additionally, ensure good thermal design and heat sinking to keep the junction temperature below 125°C.
• What is the recommended input capacitor type and value for optimal performance?
  A low-ESR ceramic capacitor with a value of 10uF to 22uF is recommended for input decoupling. The capacitor should be placed as close to the VIN pin as possible to minimize noise and ripple.
• How do I troubleshoot oscillations or instability in the output voltage?
  To troubleshoot oscillations or instability in the output voltage, check the input voltage, output load, and PCB layout for any noise or resonance. Ensure that the input capacitor is properly sized and placed, and that the output capacitor is of sufficient value and type. Also, check for any parasitic inductance or capacitance in the layout.
• What is the recommended output capacitor type and value for optimal performance?
  A low-ESR ceramic or tantalum capacitor with a value of 10uF to 47uF is recommended for output filtering. The capacitor should be placed as close to the VOUT pin as possible to minimize noise and ripple.