The maximum safe operating area (SOA) for the TIP135 is not explicitly stated in the datasheet, but it can be estimated based on the device's thermal resistance and maximum junction temperature. As a general rule, it's recommended to keep the device within the SOA to prevent thermal runaway and ensure reliable operation.
To choose the correct heatsink for the TIP135, you need to consider the device's power dissipation, thermal resistance, and maximum junction temperature. A good starting point is to calculate the required thermal resistance of the heatsink based on the device's power dissipation and maximum junction temperature. You can then select a heatsink that meets or exceeds this requirement.
The recommended PCB layout for the TIP135 involves keeping the device's leads as short as possible, using a solid ground plane, and minimizing the thermal resistance between the device and the heatsink. It's also important to ensure good thermal conductivity between the device and the heatsink, and to avoid thermal hotspots.
To protect the TIP135 from electrical overstress (EOS), it's recommended to use a combination of voltage clamping devices, such as zener diodes or transient voltage suppressors (TVS), and to ensure that the device is operated within its recommended voltage and current ratings. Additionally, using a fuse or a current-limiting resistor can help prevent excessive current from flowing through the device.
The recommended storage and handling procedure for the TIP135 involves storing the devices in their original packaging, away from direct sunlight and moisture. It's also important to handle the devices by the body, rather than the leads, to prevent mechanical stress and damage. Additionally, it's recommended to use anti-static precautions when handling the devices to prevent electrostatic discharge (ESD) damage.
TIP135 datasheet
by STMicroelectronics
