Texas Instruments recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat. A minimum of 2 oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including junction temperature (Tj) and storage temperature (Tstg). Additionally, consider using a heat sink or thermal interface material to reduce the junction-to-ambient thermal resistance.
The maximum allowed voltage on the input pins is 5.5V, which is the absolute maximum rating. However, for reliable operation, it's recommended to keep the input voltage within the recommended operating range of 4.5V to 5.5V.
The TIL186-3 is not hermetically sealed, so it's not recommended for use in high-humidity environments. However, if you must use it in such an environment, ensure that the device is properly sealed or conformally coated to prevent moisture ingress.
Texas Instruments recommends a soldering temperature of 260°C (500°F) for a maximum of 10 seconds. It's essential to follow the recommended soldering profile to prevent damage to the device.
