TIC216M datasheet by Texas Instruments

TIC216M Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for the TIC216M to minimize EMI and thermal issues?
  TI recommends a 4-layer PCB with a solid ground plane, and a thermal pad connected to a large copper area for heat dissipation. A minimum of 2 oz copper thickness is recommended for the power traces.
• How do I ensure the TIC216M is properly biased for optimal performance?
  The TIC216M requires a stable input voltage (VIN) and a precise voltage reference (VREF) for optimal performance. Ensure VIN is within the recommended range (4.5V to 18V) and VREF is set to 2.5V ±1% for best results.
• What is the maximum allowed current through the TIC216M's output stage?
  The TIC216M's output stage is designed to handle a maximum continuous current of 2A. Exceeding this limit may cause overheating, reduced lifespan, or even damage to the device.
• How do I protect the TIC216M from overvoltage and overcurrent conditions?
  Implement overvoltage protection (OVP) and overcurrent protection (OCP) circuits to prevent damage from voltage spikes or excessive current. TI recommends using a voltage supervisor and a current sense resistor to monitor and respond to abnormal conditions.
• What is the recommended operating temperature range for the TIC216M?
  The TIC216M is rated for operation between -40°C and 125°C (junction temperature). Ensure proper thermal management and heat dissipation to maintain a safe operating temperature.