Texas Instruments recommends a 2-layer PCB with a solid ground plane on the bottom layer and a thermal relief pattern on the top layer to ensure good thermal dissipation. A minimum of 2 oz copper thickness is recommended for the PCB.
To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, provide adequate heat sinking, and use a thermal interface material (TIM) with a thermal conductivity of at least 1 W/m-K. Additionally, consider using a heat sink with a thermal resistance of less than 10°C/W.
Although the datasheet specifies a maximum input voltage of 5.5V, it's recommended to limit the input voltage to 5V to ensure reliable operation and prevent damage to the device.
To prevent electrostatic discharge (ESD) damage, it's recommended to use ESD protection devices, such as TVS diodes or ESD arrays, on the input pins. Additionally, follow proper handling and storage procedures to prevent ESD damage.
To prevent latch-up and ensure reliable operation, it's recommended to power up the device in the following sequence: VCC, then VIN, and finally the input signals. Power down in the reverse sequence.
TIBPAL20L8-5CFN datasheet
by Texas Instruments
