TIBPAL20L8-10MFKB datasheet by Texas Instruments

TIBPAL20L8-10MFKB Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  Texas Instruments recommends a thermal pad layout with a minimum of 2 oz copper thickness, and a thermal via array with a minimum of 10 vias under the package to ensure optimal thermal performance.
• How do I ensure reliable operation at high temperatures?
  To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, use a suitable thermal interface material, and implement a robust thermal management system to keep the junction temperature below 150°C.
• What is the maximum allowed voltage on the input pins?
  The maximum allowed voltage on the input pins is 5.5V, which is the absolute maximum rating. However, it's recommended to keep the input voltage within the recommended operating range of 3.3V ± 10% to ensure reliable operation.
• How do I handle ESD protection for this device?
  Texas Instruments recommends using a human body model (HBM) ESD protection circuit with a minimum of 2 kV rating to protect the device from electrostatic discharge. Additionally, follow proper handling and storage procedures to prevent ESD damage.
• What is the recommended power sequencing for this device?
  The recommended power sequencing is to power up the VCC pin before the VIN pin, and to power down the VIN pin before the VCC pin. This ensures that the internal voltage regulators are properly initialized and avoids any potential latch-up conditions.