TIBPAL16R6-30MJB datasheet by Texas Instruments

TIBPAL16R6-30MJB Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  Texas Instruments recommends a thermal pad layout with a minimum of 2 oz copper thickness, and a thermal via array with a minimum of 10 vias under the package to ensure optimal thermal performance.
• How do I ensure reliable operation at high temperatures?
  To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, use a suitable thermal interface material, and implement a robust thermal management system to keep the junction temperature below 150°C.
• What is the maximum allowed voltage on the input pins?
  The maximum allowed voltage on the input pins is 5.5V, which is the absolute maximum rating. However, it's recommended to keep the input voltage within the recommended operating range of 3.3V ± 10% to ensure reliable operation.
• How do I handle ESD protection for this device?
  The TIBPAL16R6-30MJB has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing. Additionally, consider adding external ESD protection devices if the device will be exposed to harsh environments.
• What is the recommended power-up sequence for this device?
  The recommended power-up sequence is to apply the power supply voltage (VCC) before applying any input signals. This ensures that the internal voltage regulators and bias circuits are properly initialized before the device starts operating.