Texas Instruments recommends a thermal pad on the bottom of the package, connected to a solid copper plane on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended for the thermal plane.
To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including voltage, current, and power dissipation. Additionally, consider using thermal management techniques, such as heat sinks or thermal interfaces, to keep the device temperature within the specified range.
The maximum allowable voltage on the input pins is 5.5V, which is the absolute maximum rating. However, for reliable operation, it's recommended to keep the input voltage within the specified operating range of 3.3V ± 10%.
The TIBPAL16R4-25CFN has built-in ESD protection, but it's still essential to follow proper handling and storage procedures to prevent damage. Use anti-static wrist straps, mats, and packaging materials, and avoid touching the device pins or exposed internal circuitry.
For optimal clock signal integrity, use a low-skew, low-jitter clock source, and terminate the clock signal with a 50Ω resistor to VCC or GND, depending on the clock signal type. Additionally, consider using a clock buffer or repeater to maintain signal quality.