TIBPAL16L8-15MJ datasheet by Texas Instruments

TIBPAL16L8-15MJ Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  Texas Instruments recommends a thermal pad on the bottom of the package, connected to a solid copper plane on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended for the thermal plane.
• How do I ensure signal integrity with the high-speed signals on this device?
  To ensure signal integrity, use controlled impedance traces, and follow the recommended routing guidelines for high-speed signals. Also, use termination resistors and decoupling capacitors as recommended in the datasheet to minimize signal reflections and noise.
• What is the maximum operating temperature range for this device?
  The TIBPAL16L8-15MJ is rated for operation from -40°C to 125°C. However, it's recommended to derate the device's performance and power consumption at higher temperatures to ensure reliable operation.
• Can I use this device in a radiation-hardened application?
  The TIBPAL16L8-15MJ is not specifically designed or tested for radiation-hardened applications. If you need a radiation-hardened device, consider using a different part from Texas Instruments' radiation-hardened product line.
• What is the recommended power-up sequence for this device?
  The recommended power-up sequence is to apply VCC first, followed by VPP, and then the input signals. This ensures that the device powers up correctly and minimizes the risk of latch-up or damage.