Texas Instruments provides a recommended PCB layout in the THS4021IDGN evaluation module documentation, which includes guidelines for component placement, routing, and grounding to minimize noise and ensure optimal performance.
The choice of input and output capacitors depends on the specific application requirements, such as frequency response, noise tolerance, and power supply rejection. TI recommends using low-ESR capacitors with a value of 10uF to 22uF for input and output capacitors, and provides guidance on capacitor selection in the datasheet and application notes.
The THS4021IDGN is specified to operate from -40°C to 125°C, but it's recommended to derate the device's performance at extreme temperatures. Consult the datasheet and reliability reports for more information on temperature-related performance and reliability.
To ensure EMC, follow proper PCB layout and design guidelines, use shielding and filtering components as needed, and consider using a metal shield or enclosure for the device. TI provides EMC-related guidance in the datasheet and application notes.
The recommended power-up sequence is to apply the power supply voltage (VCC) before applying the input signal, and to remove the input signal before removing the power supply voltage. This helps prevent damage to the device and ensures proper operation.
THS4021IDGN datasheet
by Texas Instruments
