STMicroelectronics recommends a 2-layer PCB with a solid ground plane on the bottom layer and a thermal relief pattern on the top layer to ensure optimal thermal performance.
To ensure reliable operation in high-temperature environments, it is recommended to derate the device's power dissipation according to the temperature derating curve provided in the datasheet, and to ensure good thermal conduction to the PCB and heat sink.
STMicroelectronics recommends a soldering profile with a peak temperature of 260°C, a dwell time above 217°C of 60-90 seconds, and a cooling rate of 4°C/s to prevent thermal shock.
To protect the device from ESD, it is recommended to handle the device in an ESD-protected environment, use ESD-protective packaging, and ensure that the device is properly grounded during handling and assembly.
STMicroelectronics recommends storing the device in its original packaging, away from direct sunlight and moisture, and handling the device by the body or leads to prevent damage.
THBT20011D datasheet
by STMicroelectronics
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