The recommended land pattern for TH3E107K016D0150 is a rectangular pad with a size of 2.5 mm x 1.5 mm, with a solder mask clearance of 0.2 mm. It's essential to follow the recommended land pattern to ensure proper soldering and to prevent thermal issues.
To handle thermal management, ensure good thermal conductivity between the device and the PCB by using a thermal pad or thermal interface material. Also, consider using a heat sink or a thermal management system to dissipate heat efficiently. The maximum operating temperature is 150°C, so it's crucial to keep the device within the recommended temperature range.
The recommended soldering profile for TH3E107K016D0150 is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. It's essential to follow a controlled soldering process to prevent damage to the device.
Yes, TH3E107K016D0150 is designed to withstand high-vibration environments. However, it's essential to ensure that the device is properly mounted and secured to the PCB to prevent mechanical stress. Additionally, consider using a vibration-dampening material or a mechanical fixative to further reduce the risk of mechanical failure.
Store TH3E107K016D0150 in a dry, cool place, away from direct sunlight and moisture. Handle the devices by the body, avoiding touching the leads or the ceramic body to prevent electrostatic discharge (ESD) damage. Use anti-static packaging and follow proper ESD handling procedures to prevent damage during storage and handling.
