A good thermal design should be used to ensure the device operates within the recommended temperature range. A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. Additionally, vias should be placed under the package to connect the thermal pad to the copper area.
To ensure EMC, it is recommended to use a shielded enclosure, keep the device away from antennas and other sources of electromagnetic radiation, and use a common-mode choke or ferrite bead on the power supply lines. Additionally, a decoupling capacitor should be placed close to the device to filter out high-frequency noise.
The recommended power-up sequence is to first apply the analog power supply (VCC) and then the digital power supply (VDD). The power-down sequence should be reversed, with VDD being turned off before VCC.
To troubleshoot issues, start by checking the power supply voltages and ensuring they are within the recommended range. Check for proper grounding and decoupling. Use an oscilloscope to check the output signals and verify that they are within the expected range. If issues persist, consult the datasheet and application notes for further guidance.
The maximum allowed power dissipation for the TDA8920CJ is 2.5 W. It is essential to ensure that the device operates within this limit to prevent overheating and damage.
TDA8920CJ/N1,112 datasheet
by NXP Semiconductors
