TDA75613LV datasheet by STMicroelectronics

TDA75613LV Frequently Asked Questions (FAQs)

• What is the maximum power dissipation of the TDA75613LV?
  The maximum power dissipation of the TDA75613LV is 2.5W, but it can be limited by the thermal resistance of the package and the PCB. It's recommended to keep the junction temperature below 150°C to ensure reliable operation.
• How do I optimize the layout for the TDA75613LV to minimize EMI?
  To minimize EMI, it's recommended to follow good PCB design practices such as keeping the power supply lines short and away from the output stage, using a solid ground plane, and placing the input and output capacitors close to the device. Additionally, using a shielded inductor and placing it away from the device can also help reduce EMI.
• What is the recommended input capacitor value for the TDA75613LV?
  The recommended input capacitor value for the TDA75613LV is 10uF to 22uF, with a voltage rating of at least 25V. A larger capacitor value can help improve the power supply rejection ratio (PSRR) and reduce output voltage ripple.
• Can I use the TDA75613LV in a high-temperature environment?
  The TDA75613LV is rated for operation up to 125°C, but it's recommended to derate the power dissipation at higher temperatures to ensure reliable operation. It's also important to consider the thermal resistance of the package and the PCB when operating at high temperatures.
• How do I protect the TDA75613LV from overvoltage and undervoltage conditions?
  The TDA75613LV has built-in overvoltage protection (OVP) and undervoltage lockout (UVLO) features. However, it's still recommended to add external protection circuitry such as a voltage supervisor or a crowbar circuit to protect the device from voltage transients and faults.