The recommended PCB layout for the TDA7479D is to keep the input and output stages separate, with a ground plane in between to reduce noise and electromagnetic interference (EMI). Additionally, it's recommended to use a symmetrical layout for the audio channels to minimize channel-to-channel crosstalk.
To optimize the TDA7479D for low noise and distortion, ensure that the power supply is well-regulated and decoupled, use a low-ESR capacitor for the output filter, and keep the input impedance as low as possible. Additionally, use a high-quality audio-grade capacitor for the input coupling capacitor and ensure that the PCB layout is optimized for minimal noise and EMI.
The maximum power dissipation of the TDA7479D is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 1.4W at an ambient temperature of 70°C. However, it's recommended to derate the power dissipation to ensure reliable operation over the entire operating temperature range.
No, the TDA7479D is not suitable for use in a Class-D amplifier configuration. It's a Class-AB amplifier and is designed for linear audio applications. Using it in a Class-D configuration may result in poor audio quality, increased distortion, and reduced reliability.
To protect the TDA7479D from overvoltage and overcurrent, use a voltage regulator with overvoltage protection (OVP) and a current limiter or fuse in series with the power supply. Additionally, ensure that the output stage is protected from overcurrent by using a current-sensing resistor and a comparator to detect overcurrent conditions.
TDA7479D datasheet
by STMicroelectronics
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