A good PCB layout for the TDA7439DS13TR involves keeping the analog and digital grounds separate, using a star-ground configuration, and placing the device close to the power supply. Additionally, using a 4-layer PCB with a dedicated ground plane can help reduce EMI.
To ensure proper power and decoupling, use a 3.3V or 5V power supply, and add a 10uF capacitor between the VCC and GND pins. Additionally, add a 100nF capacitor between the AVCC and GND pins for analog power supply decoupling.
The TDA7439DS13TR supports a maximum clock frequency of 50 MHz, but it's recommended to operate at a frequency below 40 MHz to ensure reliable operation.
To configure the TDA7439DS13TR for I2S mode, set the MODE pin to LOW and the FS pin to HIGH. For SPI mode, set the MODE pin to HIGH and the FS pin to LOW. Refer to the datasheet for specific pin configurations and timing diagrams.
The maximum power consumption of the TDA7439DS13TR is approximately 120mW at 3.3V and 25°C, but this can vary depending on the operating frequency, voltage, and other factors.
TDA7439DS13TR datasheet
by STMicroelectronics
