A good PCB layout for the TDA7386 involves keeping the power supply lines (VIN and VCC) separate from the signal lines, using a star connection for the power supply, and placing the decoupling capacitors close to the IC. A 4-layer PCB with a dedicated ground plane is recommended.
The output filter components (L, C, and R) should be chosen based on the desired cutoff frequency, impedance, and attenuation. A good starting point is to use the values recommended in the datasheet, and then adjust them based on the specific application requirements.
The maximum power dissipation of the TDA7386 depends on the package type and the ambient temperature. For the DFN8 package, the maximum power dissipation is 1.4W at 25°C, while for the SO8 package, it is 1.1W at 25°C.
The TDA7386 has built-in overvoltage protection (OVP) and undervoltage protection (UVP) circuits. However, additional external protection circuits can be added to provide extra protection against voltage surges and spikes.
The recommended input capacitor value for the TDA7386 is 10uF to 22uF, with a voltage rating of at least 10V. The capacitor should be placed as close as possible to the VIN pin.
TDA7386 datasheet
by STMicroelectronics
