A good PCB layout for the TDA7385 involves keeping the power supply lines (VIN and VCC) separate from the signal lines, using a star connection for the power supply, and placing the decoupling capacitors close to the IC. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
The output filter components (L, C, and R) should be chosen based on the desired cutoff frequency, impedance, and attenuation. A good starting point is to use the values recommended in the datasheet, and then adjust them based on the specific application requirements and measurement results.
The maximum power dissipation of the TDA7385 depends on the package type and the ambient temperature. For the DFN8 package, the maximum power dissipation is 1.4 W at 70°C, and for the SO8 package, it is 1.1 W at 70°C. The power dissipation can be calculated using the formula: Pd = (VIN - VOUT) x IOUT + VIN x IQ, where IQ is the quiescent current.
To ensure the stability of the TDA7385, it is essential to follow the recommended layout and component selection guidelines, use a sufficient output capacitor value, and ensure that the input voltage is within the recommended range. Additionally, the output voltage should be monitored to prevent overvoltage or undervoltage conditions.
The TDA7385 is rated for operation up to 150°C, but the maximum junction temperature (TJ) should not exceed 150°C. The device can be used in high-temperature environments, but the power dissipation should be derated accordingly, and the thermal management should be ensured through proper heat sinking and cooling.
TDA7385 datasheet
by STMicroelectronics
Findchips
Findchips