TD351IDT datasheet by STMicroelectronics

TD351IDT Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for airflow and heat dissipation.
• How do I ensure reliable operation in high-temperature environments?
  Implement a thermal management system, such as a heat sink or fan, to maintain a junction temperature below 150°C. Also, ensure proper PCB design and component selection to minimize thermal resistance.
• What is the recommended input capacitor value and type for the TD351IDT?
  A 10uF to 22uF X7R or X5R ceramic capacitor is recommended, with a voltage rating of 25V or higher, placed as close as possible to the VIN pin.
• How do I optimize the output voltage ripple and noise?
  Use a low-ESR output capacitor (e.g., 22uF X7R or X5R ceramic) and add a 10nF to 100nF ceramic capacitor in parallel to filter high-frequency noise. Ensure proper PCB layout and decoupling to minimize parasitic inductance.
• What is the maximum allowed input voltage transient for the TD351IDT?
  The device can withstand input voltage transients up to 28V for a maximum duration of 100ms. Exceeding this may cause damage or malfunction.