A good PCB layout for the TD350ETR should include a solid ground plane, a separate power plane for the input voltage, and a heat sink attached to the thermal pad. The layout should also minimize thermal resistance and ensure good airflow around the device.
The input capacitor should be chosen based on the input voltage ripple requirement, output voltage, and the maximum input current. A low-ESR capacitor with a capacitance value of 10-22uF is recommended. The capacitor should also be rated for the maximum input voltage and have a low temperature coefficient.
The TD350ETR can deliver up to 3.5A of output current, but this may vary depending on the input voltage, output voltage, and ambient temperature. It's recommended to check the device's thermal performance and adjust the output current accordingly to prevent overheating.
To ensure stability, the TD350ETR requires a minimum output capacitance of 10uF, and the output voltage should be decoupled with a capacitor of at least 1uF. The input voltage should also be decoupled with a capacitor of at least 1uF. Additionally, the PCB layout should be designed to minimize parasitic inductance and capacitance.
The TD350ETR has a thermal pad that should be connected to a heat sink or a thermal interface material to dissipate heat. The heat sink should be designed to provide good airflow and have a thermal resistance of less than 10°C/W. The device should also be placed in a well-ventilated area to prevent overheating.
TD350ETR datasheet
by STMicroelectronics
