Texas Instruments recommends a 2-layer or 4-layer PCB with a solid ground plane and thermal vias to improve heat dissipation. A minimum of 2 oz copper thickness is recommended for the top and bottom layers.
To ensure accurate temperature measurement, it's essential to follow proper PCB layout guidelines, use a high-quality thermal interface material (TIM) between the device and the heat sink, and calibrate the device according to the datasheet instructions.
The maximum junction temperature (Tj) for the TCM129C13AN is 150°C. Operating the device above this temperature can reduce its lifespan and affect its performance.
Yes, the TCM129C13AN is designed to operate in high-vibration environments. However, it's essential to ensure that the device is properly secured to the PCB and that the PCB is designed to withstand the vibration levels.
The TCM129C13AN has a built-in POR and BOR feature. To handle these features, ensure that the power supply is stable and within the recommended operating range. Also, use a capacitor with a suitable value and ESR to filter the power supply and prevent false resets.
