Texas Instruments recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including junction temperature (TJ) and storage temperature (Tstg). Additionally, consider using thermal management techniques such as heat sinks, thermal interfaces, and airflow to keep the device within the recommended temperature range.
When selecting a heat sink for the TBP28L22N, consider the thermal resistance (RθJA), thermal interface material (TIM) thermal resistance, and the heat sink's thermal conductivity. A heat sink with a low thermal resistance (RθJA) and a high thermal conductivity is recommended to ensure efficient heat dissipation.
To calculate the power dissipation of the TBP28L22N, use the formula: Pd = (Vin - Vout) x Iout x Efficiency. Where Vin is the input voltage, Vout is the output voltage, Iout is the output current, and Efficiency is the device's efficiency. Consult the datasheet for the device's efficiency curve and thermal characteristics to ensure accurate calculations.
Texas Instruments recommends using low-ESR capacitors with a minimum capacitance of 10uF for the input and output. The capacitors should be rated for the maximum input voltage and output voltage, respectively. Additionally, consider using X7R or X5R dielectric capacitors for their high reliability and low temperature coefficient.
TBP28L22N datasheet
by Texas Instruments
