Texas Instruments provides a recommended PCB layout in the TAS5631DKD evaluation module documentation, which includes guidelines for component placement, routing, and thermal management. It's essential to follow these guidelines to ensure optimal performance and minimize electromagnetic interference (EMI).
The output filter design depends on the specific application requirements, such as output power, frequency, and load impedance. Texas Instruments provides a filter design tool and application notes that can help optimize the output filter design for the TAS5631DKD. Additionally, it's essential to consider the PCB layout, component selection, and parasitic effects when designing the output filter.
The maximum junction temperature (Tj) for the TAS5631DKD is 150°C. However, it's recommended to keep the junction temperature below 125°C for optimal performance and reliability. The device has a built-in thermal protection feature that will shut down the device if the junction temperature exceeds 150°C.
The TAS5631DKD has a built-in overcurrent protection feature that can be enabled through the OCP pin. The OCP pin can be connected to a resistor and capacitor network to set the overcurrent threshold and response time. Additionally, external overcurrent protection circuits can be implemented using sense resistors, comparators, and logic gates.
The recommended power-up sequence for the TAS5631DKD is to first apply the power supply voltage (VCC) to the device, followed by the clock signal (CLK), and then the input signal (VIN). This sequence ensures that the device is properly initialized and configured before the input signal is applied.
TAS5631DKD datasheet
by Texas Instruments
