T850-6G datasheet by STMicroelectronics

T850-6G Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  STMicroelectronics recommends a 2-layer PCB with a thermal pad connected to a large copper area on the bottom layer to dissipate heat efficiently.
• How do I ensure reliable operation in high-temperature environments?
  Implement a thermal management system, such as a heat sink or fan, to keep the junction temperature below 150°C. Also, ensure proper PCB design and layout to minimize thermal resistance.
• What is the recommended input capacitor value and type for stable operation?
  A 10uF to 22uF X7R or X5R ceramic capacitor is recommended for input decoupling, placed as close to the T850-6G as possible.
• How do I minimize electromagnetic interference (EMI) in my design?
  Use a shielded enclosure, keep the T850-6G away from antennas and other EMI sources, and ensure proper PCB layout and grounding to minimize radiation.
• What is the maximum allowed voltage drop across the T850-6G?
  The maximum allowed voltage drop is 0.5V. Exceeding this may affect the device's reliability and performance.