STMicroelectronics provides a recommended PCB layout in their application note AN5343, which includes guidelines for thermal pad connection, copper pouring, and via placement to ensure optimal thermal performance.
The thermal shutdown feature is enabled by default. To handle it during power-up, ensure that the VIN pin is ramped up slowly (typically 10-20 ms) to allow the internal thermal shutdown circuitry to stabilize before the device becomes operational.
The EN pin is a digital input and should not exceed the maximum rating of 6V. Applying a voltage higher than 6V can damage the device. It's recommended to use a voltage regulator or a level shifter to ensure the EN pin voltage remains within the specified range.
While the T850-6G-TR is rated for operation up to 150°C, it's essential to consider the derating curves provided in the datasheet to ensure the device operates within its specified limits. Additionally, proper thermal management, such as heat sinking and airflow, is crucial to maintain reliability in high-temperature environments.
STMicroelectronics provides a troubleshooting guide in their application note AN5342, which covers common issues, such as output voltage regulation, thermal shutdown, and overcurrent protection. It's recommended to follow the guide to identify and resolve potential issues.
