STMicroelectronics recommends a 2-layer PCB with a solid ground plane on the bottom layer and a thermal relief pattern on the top layer to ensure good thermal dissipation.
To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal management practices, such as providing adequate heat sinking, using thermal interface materials, and ensuring good airflow around the device.
STMicroelectronics recommends soldering the T2550-12I using a reflow soldering process with a peak temperature of 260°C (500°F) and a dwell time of 30-60 seconds.
To prevent electrostatic discharge (ESD) damage, it's essential to handle the T2550-12I with ESD-protective equipment, such as wrist straps, mats, and bags, and to follow proper ESD-handling procedures.
STMicroelectronics recommends storing the T2550-12I in a dry, cool place, away from direct sunlight, with a relative humidity of 60% or less, and at a temperature range of -40°C to 125°C (-40°F to 257°F).
T2550-12I datasheet
by STMicroelectronics
Findchips
