T2535-800G datasheet by STMicroelectronics

T2535-800G Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  STMicroelectronics recommends a 2-layer or 4-layer PCB with a thermal pad connected to a large copper area on the bottom layer to dissipate heat efficiently.
• How do I ensure reliable operation in high-temperature environments?
  Implement a thermal management system, such as a heat sink or fan, to keep the junction temperature below 150°C. Also, ensure good airflow and avoid blocking the thermal pad.
• What is the maximum allowed voltage on the input pins?
  The maximum allowed voltage on the input pins is 5.5V, exceeding which may cause permanent damage to the device.
• How do I handle ESD protection for the T2535-800G?
  Use ESD protection devices, such as TVS diodes or ESD arrays, on the input lines to protect the device from electrostatic discharge.
• What is the recommended power-up sequence for the T2535-800G?
  Power up the device in the following sequence: VCC, then VIN, and finally the input signals. This ensures proper device initialization and prevents latch-up.