A recommended PCB layout for optimal thermal performance would be to use a large copper pad under the device, connected to a thermal via or a heat sink. This helps to dissipate heat efficiently and reduce thermal resistance.
To ensure reliable soldering, use a soldering iron with a temperature range of 250°C to 260°C, and a solder with a melting point of 180°C to 190°C. Apply a small amount of solder paste to the pads, and use a reflow oven or a hot air gun to solder the component.
The maximum allowed voltage derating for the T18501KT10 is typically 80% of the maximum rated voltage. This means that if the maximum rated voltage is 100V, the maximum allowed voltage derating would be 80V.
To handle ESD protection for the T18501KT10, use an ESD wrist strap or mat when handling the component. Ensure that the PCB design includes ESD protection devices, such as TVS diodes or ESD protection arrays, to protect the component from electrostatic discharge.
The recommended storage condition for the T18501KT10 is in a dry, cool place with a temperature range of 20°C to 30°C and a relative humidity of 50% to 60%. Avoid storing the component in direct sunlight or near heat sources.
