The recommended land pattern for the SWPA4030S4R7MT is a rectangular pad with a size of 2.5mm x 1.6mm, with a non-solder mask defined (NSMD) pad shape.
The SWPA4030S4R7MT has a thermal resistance of 30°C/W. To handle thermal considerations, ensure good airflow, use a heat sink if necessary, and avoid overheating the component.
The maximum operating temperature for the SWPA4030S4R7MT is 125°C, with a storage temperature range of -55°C to 150°C.
To ensure reliability in high-vibration environments, use a secure mounting method, such as soldering or adhesive, and consider using a vibration-dampening material or potting compound.
The recommended soldering profile for the SWPA4030S4R7MT is a peak temperature of 260°C, with a soldering time of 3-5 seconds, and a preheat temperature of 150°C to 180°C.