A 4-layer PCB with a solid ground plane and a separate power plane is recommended. The component should be placed near the edge of the board to minimize radiation. A via-stitching technique can be used to connect the ground plane to the heat sink.
Ensure proper heat sinking and thermal management. Use a thermal interface material (TIM) with a thermal conductivity of at least 1 W/m-K. The maximum junction temperature (Tj) should not exceed 150°C. Monitor the device's temperature and adjust the operating conditions accordingly.
A 10-22 μF input capacitor and a 10-47 μF output capacitor are recommended. The capacitors should be placed as close to the device as possible and should have a low equivalent series resistance (ESR) and a high ripple current rating.
Use a voltage supervisor or a overvoltage protection (OVP) circuit to prevent voltage exceeding the maximum rating. Implement overcurrent protection (OCP) using a current sense resistor and a comparator or a dedicated OCP IC.
The recommended operating frequency range is 2.4-2.5 GHz. Operating outside this range may affect the device's performance and efficiency.
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