The recommended PCB footprint for SUP85N15-21-E3 is a standard TO-220 package with a minimum pad size of 4.5mm x 4.5mm and a thermal pad size of 2.5mm x 2.5mm.
To ensure reliable operation of SUP85N15-21-E3 in high-temperature environments, it is recommended to derate the power dissipation according to the temperature derating curve provided in the datasheet, and to ensure good thermal management through proper heat sinking and airflow.
The maximum allowed voltage transient for SUP85N15-21-E3 is 400V, as specified in the datasheet. Exceeding this voltage may damage the device.
Yes, SUP85N15-21-E3 can be used in switching applications, but it is recommended to ensure that the switching frequency is within the recommended range of 100kHz to 200kHz, and that the device is properly snubbed to prevent voltage spikes.
To protect SUP85N15-21-E3 from electrostatic discharge (ESD), it is recommended to handle the device in an ESD-controlled environment, use ESD-protective packaging, and ensure that the device is properly grounded during handling and assembly.
SUP85N15-21-E3 datasheet
by Vishay Siliconix
