STX13003-AP datasheet by STMicroelectronics

STX13003-AP Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal performance?
  A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital sections separate, and use a common ground point for the analog and digital grounds.
• How do I ensure electromagnetic compatibility (EMC) with the STX13003-AP?
  Use a metal shield around the device, keep the PCB layout compact, and use a common mode choke or ferrite bead to filter the power supply. Ensure the device is placed at least 1 mm away from the PCB edge.
• What is the recommended power-up sequence for the STX13003-AP?
  Power up the device in the following sequence: VDD, AVDD, and then DVDD. Ensure that the power supplies are stable and within the recommended voltage range before applying the clock signal.
• How do I handle the thermal management of the STX13003-AP?
  Use a thermal pad or a heat sink to dissipate heat. Ensure good airflow around the device, and avoid blocking the airflow with components or obstacles. Keep the device temperature below 125°C.
• What is the recommended clock signal quality for the STX13003-AP?
  Use a clock signal with a frequency tolerance of ±100 ppm and a jitter of less than 100 ps. Ensure the clock signal has a rise and fall time of less than 1 ns.