The maximum junction temperature (Tj) of the STTH8R06G is 175°C, as specified in the datasheet. However, it's recommended to keep the junction temperature below 150°C for reliable operation and to prevent thermal runaway.
To ensure proper cooling, it's essential to provide a good thermal path from the device to a heat sink or a metal plate. Use a thermal interface material (TIM) with a thermal conductivity of at least 1 W/mK, and ensure the heat sink is designed to handle the maximum power dissipation of the device.
For optimal performance and thermal management, it's recommended to follow a 2-layer or 4-layer PCB layout with a solid ground plane and a separate power plane. Keep the high-current paths short and wide, and use vias to connect the power plane to the heat sink or metal plate.
Yes, the STTH8R06G is qualified for automotive and high-reliability applications. It meets the AEC-Q101 qualification standard and is designed to withstand harsh environmental conditions, including high temperatures, humidity, and vibration.
To protect the device from overvoltage and overcurrent, use a suitable voltage regulator or DC-DC converter with overvoltage protection (OVP) and overcurrent protection (OCP) features. Additionally, consider adding external protection components, such as TVS diodes or fuses, to prevent damage from voltage spikes or excessive current.
STTH8R06G datasheet
by STMicroelectronics
