STMicroelectronics recommends a PCB layout with a large copper area connected to the thermal pad to ensure good heat dissipation. A minimum of 2 oz copper thickness is recommended, and the thermal pad should be connected to a solid copper plane on the PCB.
To ensure reliable operation at high temperatures, it is essential to follow the recommended thermal design guidelines, including a proper thermal interface material (TIM) between the device and the heat sink, and a heat sink with a thermal resistance of less than 1°C/W.
The maximum allowed voltage on the input pins is 5.5V, and it is essential to ensure that the input voltage does not exceed this value to prevent damage to the device.
To protect the device from ESD, it is recommended to handle the device by the body, use an anti-static wrist strap or mat, and ensure that the PCB is designed with ESD protection in mind, including the use of ESD protection diodes and resistors.
The recommended operating frequency range for the STTH6012W is up to 100 kHz, although the device can operate at higher frequencies with reduced performance.
STTH6012W datasheet
by STMicroelectronics
