A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, using a large copper area for heat dissipation, and minimizing thermal resistance by using thermal vias and a solid ground plane.
To ensure reliable operation at high temperatures, ensure that the device is operated within the recommended temperature range, use a suitable heat sink, and implement thermal monitoring and protection mechanisms to prevent overheating.
Key considerations for EMI and RFI filtering include using a common-mode choke, adding a ferrite bead or a pi-filter, and ensuring that the PCB layout is designed to minimize radiation and susceptibility to electromagnetic interference.
Select input and output capacitors based on the device's recommended capacitance values, voltage ratings, and ESR (Equivalent Series Resistance) requirements. Ensure that the capacitors are suitable for the operating frequency and temperature range.
Critical parameters to monitor for fault detection and protection include input voltage, output voltage, current, and temperature. Implement overvoltage, undervoltage, overcurrent, and overtemperature protection mechanisms to prevent device damage.
STTH3002CG datasheet
by STMicroelectronics
