A 2-layer PCB with a solid ground plane on the bottom layer and a thermal relief pattern on the top layer is recommended. This helps to dissipate heat efficiently and reduces thermal resistance.
Ensure that the device is operated within the recommended temperature range (up to 150°C). Use a heat sink or thermal interface material to improve heat dissipation. Also, consider derating the device's power handling at high temperatures.
The maximum allowable voltage transient on the input pins is ±20 V for a duration of ≤100 ns. Exceeding this may cause damage to the device.
Use ESD protection devices such as TVS diodes or ESD suppressors on the input pins. Also, ensure that the PCB is designed with ESD protection in mind, including the use of ESD-safe handling and storage procedures.
A soldering profile with a peak temperature of 260°C and a dwell time of ≤30 seconds is recommended. This helps to prevent damage to the device during the soldering process.