A good PCB layout for optimal thermal performance involves placing the STTH112A near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Avoid placing thermal vias or heat-generating components near the STTH112A.
To ensure reliable operation at high temperatures, ensure that the STTH112A is properly mounted on a heat sink or thermal pad, and that the PCB is designed for good thermal conductivity. Also, ensure that the device is operated within its recommended temperature range (up to 150°C) and that the power dissipation is within the recommended limits.
The recommended soldering conditions for the STTH112A are: peak temperature of 260°C, soldering time of 10-30 seconds, and a maximum of 2 reflows. It is also recommended to use a soldering iron with a temperature control and a solder with a melting point of 217°C (423°F).
To protect the STTH112A from electrostatic discharge (ESD), handle the device by the body or the pins, avoid touching the pins or the die, and use an ESD wrist strap or mat. Also, ensure that the PCB and components are properly grounded, and use ESD-protective packaging and storage materials.
The recommended storage conditions for the STTH112A are: temperature range of -40°C to 125°C, relative humidity of 60% or less, and protection from direct sunlight and moisture. Store the devices in their original packaging or in a dry, clean environment.
STTH112A datasheet
by STMicroelectronics
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