STMicroelectronics provides a recommended PCB layout for the STTH10LCD06CG-TR in their application note AN5084, which includes guidelines for thermal pad connection, copper pouring, and via placement to ensure optimal thermal performance.
To ensure reliable operation in high-temperature environments, it is recommended to follow the derating guidelines provided in the datasheet, and to consider using a heat sink or thermal interface material to reduce the junction temperature. Additionally, ensure that the device is operated within the specified maximum junction temperature (Tj) of 150°C.
STMicroelectronics recommends a soldering profile with a peak temperature of 260°C, a dwell time above 217°C of 30-45 seconds, and a total process time of 60-90 seconds. It is also recommended to follow the IPC-J-STD-020 standard for reflow soldering.
To prevent damage during storage and shipping, it is recommended to store the devices in their original packaging, away from direct sunlight and moisture. Avoid bending or flexing the leads, and handle the devices by the body, not the leads. It is also recommended to follow the ESD precautions outlined in the datasheet.
The recommended test and measurement equipment for characterizing the STTH10LCD06CG-TR include a curve tracer or semiconductor parameter analyzer, a digital multimeter, and an oscilloscope. Additionally, a thermal chamber or temperature-controlled environment may be necessary for temperature-dependent measurements.
STTH10LCD06CG-TR datasheet
by STMicroelectronics
